STORAGE FORM FACTOR M.2 2230
MEMORY TYPE PCIE GEN 4.0 X4
SSD MAX SEQUENTIAL READ CDM UP TO 5000MB/S
POWER CONSUMPTION ACTIVE 4.1W AVERAGE
NAND TECHNOLOGY 3D QLC
STORAGE TEMPERATURE -40°C TO +85°C
ENDURANCE 450TBW
STORAGE HUMIDITY 93% RH (40° C)
SSD PACKAGE CONTENTS MP600 CORE MINI M.2 SSD
SSD MAX SEQUENTIAL WRITE CDM UP TO 3800MB/S
MAX RANDOM READ QD32 IOMETER UP TO 550K
MAX RANDOM WRITE QD32 IOMETER UP TO 900K
SSD SMART SUPPORT YES
SSD OPERATING TEMPERATURE 0°C TO +65°C
SSD SHOCK 1,500 G
FORM FACTOR M.2 2230
APPLICATION CONSUMER CLIENT
SSD COMPATIBILITY M.2 2230 INTERFACE CONNECTOR WINDOWS 11, WINDOWS 10, MAC OS X
VOLTAGE 3.3V, +/- 5%
VIBRATION 20HZ~80HZ/1.52MM, 80HZ~2000HZ/20G
DEVSLP PS4: 5MW
ENCRYPTION AES 256-BIT ENCRYPTION
MTBF HOURS 1,500,000 HOURS
SSD TBW 450
INTERFACE PCIE* 4 X 4
WEIGHT 0.025
MEMORY TYPE PCIE GEN 4.0 X4
SSD MAX SEQUENTIAL READ CDM UP TO 5000MB/S
POWER CONSUMPTION ACTIVE 4.1W AVERAGE
NAND TECHNOLOGY 3D QLC
STORAGE TEMPERATURE -40°C TO +85°C
ENDURANCE 450TBW
STORAGE HUMIDITY 93% RH (40° C)
SSD PACKAGE CONTENTS MP600 CORE MINI M.2 SSD
SSD MAX SEQUENTIAL WRITE CDM UP TO 3800MB/S
MAX RANDOM READ QD32 IOMETER UP TO 550K
MAX RANDOM WRITE QD32 IOMETER UP TO 900K
SSD SMART SUPPORT YES
SSD OPERATING TEMPERATURE 0°C TO +65°C
SSD SHOCK 1,500 G
FORM FACTOR M.2 2230
APPLICATION CONSUMER CLIENT
SSD COMPATIBILITY M.2 2230 INTERFACE CONNECTOR WINDOWS 11, WINDOWS 10, MAC OS X
VOLTAGE 3.3V, +/- 5%
VIBRATION 20HZ~80HZ/1.52MM, 80HZ~2000HZ/20G
DEVSLP PS4: 5MW
ENCRYPTION AES 256-BIT ENCRYPTION
MTBF HOURS 1,500,000 HOURS
SSD TBW 450
INTERFACE PCIE* 4 X 4
WEIGHT 0.025
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